Abstract: As with most aspects of electronic systems, hardware security has traditionally evolved around CMOS technology and traditional integration and packaging options. However, with the rise of various emerging technologies, whose main purpose is to overcome the fundamental limitations for scaling and power consumption of traditional CMOS approaches, unique opportunities do also arise to advance the notion of hardware security. In this talk, I will first introduce the different concepts of hardware security in general and I will review 2.5D and 3D integration as emerging technology option. In the main part of the talk, I will then discuss the application of 2.5D and 3D integration to advance the different concepts for hardware security and I will also outline related and novel challenges.
Bio: Johann Knechtel is a Research Scientist with the New York University Abu Dhabi, United Arab Emirates. He received the M.Sc. degree in Information Systems Engineering (Dipl. Ing.) and the Ph.D. degree in Computer Engineering (Dr. Ing., summa cum laude) from TU Dresden, Germany, in 2010 and 2014, respectively. His research interests cover VLSI physical design automation, with particular focus on emerging technologies and hardware security. He was a Postdoctoral Researcher with the Masdar Institute of Science and Technology, Abu Dhabi, from 2015 2016. From 2010 to 2014, he was a Ph.D. Scholar with the DFG Graduate School on “Nano and Biotechnologies for Packaging of Electronic Systems” at TU Dresden. In 2012, he was a Research Assistant with the Chinese University of Hong Kong, Hong Kong. In 2010, he was a Visiting Research Student with the University of Michigan at Ann Arbor, MI, USA.
